Intel’s next many-core chip will be a true stand-alone processor

Intel's Knights Landing-based Xeon Phi

Intel’s current Xeon Phi doesn’t really fulfill the promise of many-core computing — it’s a co-processor that needs a ‘real’ CPU to function. That will change when the next-generation Knights Landing model arrives, Intel revealed at the Supercomputing Conference this week. The 14-nanometer chip will be available as a stand-alone model that can run all software, like a traditional processor; since it won’t have to shuttle data between two components, it should be faster, easier to program and cheaper, too. There will also be high-speed memory built into the chip, as well as a number of (unspecified) architectural tweaks. Knights Landing isn’t likely to ship until late 2014 or 2015, but it could be worth the wait for researchers, server operators and anyone else who wants massively parallel computing power.

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Via: Computerworld

Source: Intel

Intel CEO Brian Krzanich shows working 14nm SoC laptop, announces sub $100 tablets at IDF 2013

Intel CEO Brian Krzanich shows working 14nm SoC laptop, announces sub $100 tablets at IDF 2013

Many eyes may be shifted south of San Francisco to a shindig in Cupertino, but Intel’s making some waves in the city. Just now onstage at IDF 2013, CEO Brian Krzanich showed off a functioning laptop running on a 14nm Broadwell Intel SoC. Naturally, Krzanich didn’t deal any other details about the laptop, but did say that we’d see those tiny chips ship by the end of this year. And, following that little nugget, Chipzilla announced that there will be tablets packing Intel silicon being sold for less than $100 this holiday season. Who will build these bargain slates? Krzanich isn’t telling, but we’ll do our best to find out, and we’ll let you know as soon as we do.

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Apple allegedly working with Samsung again on chips for 2015 devices

Apple allegedly working with Samsung again on chips for 2015 devices

Samsung has been exclusively making chips for Apple’s iOS devices since the first iPhone started shipping in 2007 — we don’t need to tell you that makes for an odd relationship. Several months ago, The Wall Street Journal reported that Apple would switch to TSMC for next year’s iOS portfolio, but now there’s some strange news coming out of Korea. According to a local publication, Apple’s 2015 iOS devices will use Samsung’s 14 nanometer FinFET technology, starting with the iPhone 7 (not the 6S?). Why would Apple switch to TSMC for just one year and then go back to Samsung? Is Apple planning to rely on both TSMC and Samsung for different product lines? Unfortunately, we’ll have to wait until Chipworks breaks out its microscopes to find out what’s really going on.

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Via: MacRumors

Source: The Korea Economic Daily

Intel gets go-ahead for $4 billion chip plant in Ireland, will produce its next-gen 14nm processors

Intel has been planning to make its Ireland base one of three global manufacturing sites for its 14nm chips since May last year, and its now been given the okay by Ireland’s lead planning agency. The new $4 billion plant will create around 4,300 jobs for the region in Co. Kildare, where Intel already has around 4,000 on staff. The two-year plan involves redeveloping its existing operation, expanding and shifting to make its smaller, more efficient 14nm process. Intel’s plans don’t stop there, however. It still plans to roll out 10nm products sometime in 2015.

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Via: Silicon Republic

Source: Pleanala

Intel sort of denies rumors about future CPUs being non-upgradeable

Intel denies nextgen CPUs will be nonupgradeable, says it'll offer LGA socket parts for 'forseeable future'

If you kept up with last week’s rumors about Intel’s 14nm Broadwell chip being hardwired and non-upgradeable, then you’ll know they were anything but precise. They never quite implied that all of Intel’s next-gen desktop processors would be soldered to the motherboard, even if Broadwell (or some of its variants) did happen to go that way. So perhaps it’s fitting that Intel’s rebuttal — reassuring as it is — maintains the theme of imprecision. In a statement to Maximum PC, the chipmaker said it…

“…remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the forseeable future…”

Now, that’s a solid promise, especially considering how careful silicon companies tend to be about revealing any long-term plans. But it’s also worth bearing in mind that the wording leaves some wriggle room for Intel — not least in terms of selling LGA socket chips only as expensive niche options (i.e. the true definition of “enthusiast”) rather than as mainstream products, should it wish to do so. Indeed, the prospect of Core i3 owners chaining themselves to HDD cages in defense of their upgrade rights may yet come to pass, and no one would want to be on the wrong side of that.

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Via: TechPowerUp

Source: Maximum PC

Intel rumored moving to non-upgradable desktop CPUs with Broadwell

Intel rumored moving to nonupgradable desktop CPUs with Broadwell

For many, the very definition of the custom desktop PC is the ability to upgrade the processor, choosing a $300 retrofit instead of a $1,500 whole-system replacement. We might have to kiss that symbolism goodbye if sources at Impress Watch, SemiAccurate and ZDNet are genuinely in the know. They claim that desktop processors built on Intel’s future, 14-nanometer Broadwell architecture will be switching from contacts based on a land grid array (LGA) to a ball grid array (BGA) that could dictate soldering the chips in laptop-style, rather than putting them in an upgrade-friendly socket. The exact reasons for the supposed switch aren’t available, but there’s speculation that it would be mutually beneficial for Intel and PC manufacturers: Intel would have more control over motherboard chipsets, while builders could save money on assembly and conveniently drive more outright PC sales. Intel hasn’t confirmed any of the strategy, so we’d still be very cautious before making any presumptions. If real, though, the switch would be glum news for chipset makers, motherboard makers and most of all hobbyists; even though socket changes have made CPU upgrades tricky in the past, having the option removed altogether could put a damper on the do-it-yourself community.

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Source: Impress Watch, SemiAccurate, ZDNet

Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life

Globalfoundries unveils14nmXM chip architecture, vows as much as 60 percent more battery life

Globalfoundries wants to show that it can play the 3D transistor game as well as Intel. Its newly unveiled 14nm-XM (Extreme Mobility) modular architecture uses the inherently low-voltage, low-leak nature of the foundry’s FinFET layout, along with a few traces of its still-in-development 20nm process, to build a 14-nanometer chip with all the size and power savings that usually come from a die shrink. Compared to the larger processors with flat transistors that we’re used to, the new technique is poised to offer between 40 to 60 percent better battery life, all else being equal — a huge help when even those devices built on a 28nm Snapdragon S4 can struggle to make it through a full day on a charge. To no one’s shock, Globalfoundries is focusing its energy on getting 14nm-XM into the ARM-based processors that could use the energy savings the most. It will be some time before you find that extra-dimensional technology sitting in your phone or tablet, though. Just as Intel doesn’t expect to reach those miniscule sizes until 2013, Globalfoundries expects its first working 14nm silicon to arrive the same year. That could leave a long wait between test production runs and having a finished product in your hands.

Continue reading Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life

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Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life originally appeared on Engadget on Sun, 23 Sep 2012 21:29:00 EDT. Please see our terms for use of feeds.

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