Hasta La Gadget!

For as often as TSMC has extolled the virtues of FinFET chip designs, we’ve been wondering exactly when we’d find them sitting in our devices. Thanks to competition from rival semiconductor firms, we’ll get them relatively soon: the company now expects to produce its first wave of FinFET-based, 16-nanometer chips toward the end of 2013. While they won’t be as nice as 14nm-XM chips in the pipeline, the 16nm parts should still offer battery life and speed improvements over the 28nm chips we know today. These improvements also won’t be the end of the road — TSMC anticipates 10nm designs built on extreme ultraviolet lithography late into 2015, and CEO Morris Chang believes there’s seven or more years of advancements in manufacturing before Moore’s Law starts breaking down. We’ll just be happy if we see FinFET reach our phones and tablets in the near term.

Filed under: Cellphones, Tablets

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Via: Phone Arena

Source: EETimes

When Samsung’s Exynos 5 Octa was announced, it was believed to be compatible with 3G networks only. As such, the HSPA+ (global) version of the Galaxy S 4 was the only handset to feature the company’s eight-core SoC — the LTE model shipping with Qualcomm’s 4G-capable, quad-core Snapdragon 600 instead. That’s apparently changed, with the Korean giant tweeting that the Exynos 5 Octa now supports LTE on 20 bands. So why even make a Snapdragon 600 version of the Galaxy S 4, then? Perhaps Samsung can’t produce as many chips as Qualcomm to meet the upcoming worldwide demand for its new flagship. This appears likely, with inews24 and new-samsunggalaxys4 reporting that the Exynos 5 Octa with LTE is currently reserved for Korean models only (SHV-E300S, SHV-E300K and SHV-E300L, to be exact). So, anyone fancy a trip to Seoul in the near future?

Filed under: Cellphones, Mobile, Samsung

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Via: GSMArena

Source: SamsungExynos (Twitter)

[MWC 2013] Today, Metaio announced an agreement with ST-Ericsson, in which the semi conductor manufacturer agrees to integrate  Metaio’s Augmented Reality hardware IP, also known as “AREngine”, into its upcoming mobile platforms via the “first application processor accelerating Augmented Reality performance on mobile devices”, according to Metaio.

We know Metaio from its Augmented Reality  mobile browser, and its multiple innovations in the field.

We do not know much about this new hardware from the information we got from Metaio, we need to ask for more details.  According to the company, the new chipset “will improve nearly all aspects of an Augmented Reality experience, yielding performance increases in speed, precision and power consumption, with up to 60 times faster initialization, more than an AR app running on existing platforms – the highest to date in the mobile industry”. In addition, Metaio claims that its AREngine “drastically reduces power consumption making all-day AR experiences possible”.

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By Ubergizmo. Related articles: NVIDIA Tegra 4i LTE Processor, Slacker Music Application Rebranded,

It’s 2013 and white hat hackers like Adam Laurie are still breaking into ID chips that are supposed to be secure. How come? Partly it’s the way of the world, because no man-made NFC or RFID security barrier can ever be truly impervious. But in practical terms, a chip’s vulnerability often stems from the fact that it can be taken apart and probed at a hacker’s leisure. The secure element doesn’t necessarily need to have power running through it or to be in the midst of near-field communication in order to yield up its cryptographic key to a clever intruder who has sufficient time and sufficient desire to breach the security of a smartphone, bank card or national border.

Which brings us to the latest device in NXP‘s SmartMX2 range — a piece of technology that is claimed to work very differently and that is expected to hit the market next year. Instead of a traditional key stored in the secure element’s memory, every single copy of this chip carries a unique fingerprint within the physical structure of its transistors. This fingerprint (aka Physically Unclonable Function, or PUF) is a byproduct of tiny errors in the fabrication process — something chip makers usually try to minimize. But NXP has found a way to amplify these flaws in a controlled way and use them for identification, and it’d take a mightily well-equipped criminal (or fare dodger, or Scrabble cheater) to reverse engineer that.

Filed under: Misc, Science, Mobile

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Chips that have 3D elements to them are very much real. Moving data in 3D hasn’t been truly viable until now, however, which makes an experimental chip from the University of Cambridge that much more special. By sandwiching a layer of ruthenium atoms between cobalt and platinum, researchers found that they can move data up and down an otherwise silicon-based design through spintronics; the magnetic field manipulation sends information across the ruthenium to its destination. The layering is precise enough to create a “staircase” that moves data one step at a time. There’s no word on if and when the technique might be applied to real-world circuitry, but the advantages in density are almost self-evident: the university suggests higher-capacity storage, while processors could also be stacked vertically instead of consuming an ever larger 2D footprint. As long as the 3D chip technology escapes the lab, computing power could take a big step forward. Or rather, upward.

Filed under: Science

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Source: University of Cambridge