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Globalfoundries wants to show that it can play the 3D transistor game as well as Intel. Its newly unveiled 14nm-XM (Extreme Mobility) modular architecture uses the inherently low-voltage, low-leak nature of the foundry’s FinFET layout, along with a few traces of its still-in-development 20nm process, to build a 14-nanometer chip with all the size and power savings that usually come from a die shrink. Compared to the larger processors with flat transistors that we’re used to, the new technique is poised to offer between 40 to 60 percent better battery life, all else being equal — a huge help when even those devices built on a 28nm Snapdragon S4 can struggle to make it through a full day on a charge. To no one’s shock, Globalfoundries is focusing its energy on getting 14nm-XM into the ARM-based processors that could use the energy savings the most. It will be some time before you find that extra-dimensional technology sitting in your phone or tablet, though. Just as Intel doesn’t expect to reach those miniscule sizes until 2013, Globalfoundries expects its first working 14nm silicon to arrive the same year. That could leave a long wait between test production runs and having a finished product in your hands.

Continue reading Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life

Filed under: Cellphones, Tablets

Globalfoundries unveils 14nm-XM chip architecture, vows up to a 60 percent jump in battery life originally appeared on Engadget on Sun, 23 Sep 2012 21:29:00 EDT. Please see our terms for use of feeds.

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The dual and quad core processors used in modern smartphones make the devices extremely capable, but also run extremely hot. So to wrangle all that excess heat without adding too much bulk, Panasonic has managed to shrink its graphite heat shields to a mere 10μm (microns) thick. (Size comparison: A human red blood cell is 5μm across.) At one-one-hundred-thousandth of a meter, this shield is the world’s thinnest. More »

We saw a leaked hint of what was coming for Intel’s Valleyview system-on-a-chip (SoC), but now the full plan appears to have been outed by Chinese blog Expreview. The lineup will feature four models of the 22nm chips, with the D- and M-series looking to replace the Cedar Trail 32nm SoC chips used in current netbook and low-end desktop devices. The I-series is for embedded and industrial use, while the T-series would appear in tablets and other small form-factor devices, according to the leaked slides. That model would supersede the Clover Trail SoCs, which are only just arriving themselves in upcoming Windows 8 slates like the Acer W510 or Asus Tablet 810.

The chips should offer a burly horsepower bump over their predecessors, with up to four cores and clock speeds topping out at 2.4Ghz. The icing on the cake will be the integrated Gen 7 graphics engines of Ivy Bridge fame, featuring the same HD 4000 and HD 2500 GPU‘s as the grownup chips, but with only four “execution units” instead of the 16 you’d find there. That would offload functions like video decoding and 3D rendering from the CPU and allow simultaneous display to a TV or monitor. Bay Trail would also support 8GB of DDR3 RAM, double that of the “last” gen, as well as USB 3.0, SATA 2.0 and a host of other connection options. If the leak is accurate, the processors would arrive sometime next year, we’ll just have to wait and see if that’s soon enough for Intel to take a run at its formidable competition.

Filed under: Desktops, Laptops, Tablets

Intel’s full Atom ‘Bay Trail’ roadmap leaked: 22nm, Ivy Bridge graphics, quad-core originally appeared on Engadget on Wed, 29 Aug 2012 08:42:00 EDT. Please see our terms for use of feeds.

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Samsung has announced that it will be spending $3-$4 billion on upgrading one of its chip manufacturing plants in Austin, Texas. The Austin Statesman reports that Samsung will be upgrading “roughly half” of its plant in order to make higher quality chips for mobile phones and tablets, and that this process is expected to take around a year. That section of the plant was shut down last month, and when it opens back up in 2013, Samsung will have a variety of new equipment at its disposal.

This plant in particular is widely assumed to build processors for Apple devices, so even though Samsung and Apple are currently locked in a courtroom tussle, this move by Samsung is one that Apple will eventually benefit from too. The process of removing the old equipment and replacing it is expected to take around six months, with employees going through training before that section of the plant becomes operational sometime in the latter half of next year.

Some more good news: Samsung won’t be laying off any employees while this section of the plant is shut down. The last time Samsung upgraded one of its plants, it laid off workers during the construction process. That won’t happen this time around, as Samsung will be putting those employees through training while the new equipment is installed. Samsung says this won’t add a large number of permanent jobs at the company, but it will put around 2,000 people to work temporarily as the current equipment is upgraded.

When everything is said and done, the entire facility will be producing SoC chipsets for mobile devices and tablets. The old equipment is being removed from the facility ask you read this, with installation of the new equipment scheduled to begin sometime in September. Be sure to have a look at our story timeline below for more news on Samsung’s recent happenings!

Samsung investing billions in mobile chip plant is written by Eric Abent & originally posted on SlashGear.
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Ten-core, 2.4GHz Xeons? Pshaw. IBM is used to the kind of clock speeds and brute force power that lead to Europe-dominating supercomputers. Big Blue has no intentions of letting its guard down when it unveils its next generation processors at the upcoming Hot Chips conference: the company is teasing that the “zNext” chip at the heart of a future System z mainframe will ramp up to 5.5GHz — that’s faster than the still-speedy 5.2GHz z196 that has led IBM’s pack since 2010. For those who don’t need quite that big a sledgehammer, the technology veteran is hinting that its upcoming Power7+ processors will be up to 20 percent faster than the long-serving Power7, whose current 4.14GHz peak clock rate may seem quaint. We’ll know just how much those extra cycles mean when IBM takes to the conference podium on August 29th, but it’s safe to say that our databases and large-scale simulations won’t know what hit them.

Filed under: Desktops

IBM pushing System z, Power7+ chips as high as 5.5GHz, mainframes get mightier originally appeared on Engadget on Sat, 04 Aug 2012 02:17:00 EDT. Please see our terms for use of feeds.

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