Why Qualcomm Wants To Bring Ultrasound Transmitters To Smartphones And Tablets

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Mobile chipmaker Qualcomm has a track record of pushing new capabilities into its chips faster than its competitors in a bid to carve out a bigger chunk of the market. Last year, for instance, its LTE Snapdragon processor helped it to take a 48 per cent revenue share in H1 (Strategy Analytics‘ figure), helping to drive more LTE handsets into the market which in turn accelerated the rate of 4G adoption.

The company made an interesting acquisition last November, buying some of the assets of an Israeli company called EPOS which makes digital ultrasound technology. Ultrasound may seem an odd technology to push into consumer electronics but Qualcomm clearly sees it as another differentiator for its chips, thanks to its potential to offer some novel additions to the user interface space — both for stylus-based inputs and even touch-less interfaces like gestures.

Discussing Qualcomm’s interest in ultrasound at the Mobile World Congress tradeshow in Barcelona, Raj Talluri, SVP of Product Management, explained that to put the technology to work in mobile devices an ultrasound transmitter could be located in a stylus, with microphones sited on the mobile device that can then detect the position of the pen.

Samsung has already included a capacitive stylus with its Galaxy Note phablet but Talluri said an ultrasound-based stylus would extend the capabilities — allowing a stylus to be used off-screen, say on the table top next to where your phone is resting, and still have its input detected.

“It’s is better [than a capacitive stylus] in some key different ways which we’re working on getting to market – for example you could write here [on the table next to the phone] and it will still detect where it is. So let’s say you have a [paper] notepad… and you have a phone [nearby on the table] and you can start writing on your notepad it will actually also be transcribed into text on the phone because what happens is the ultrasound can be used to calibrate any reasonable distance,” he told TechCrunch.

The technology could also support gesture-based interactions by positioning an ultrasound transmitter on the mobile device. “There are many use cases of ultrasound,” said Talluri. “You could put a little ultrasound transmitter here [on the corner of the screen] and transmit stuff and then when you cut the ultrasound field [by swiping above the device’s screen] you can do gestures.

“There’s many different things you can do with it, once you have it. So we’re working on it and hopefully we’ll get it to commercial products.”

Talluri would not be drawn on the likely timeframe of bringing this technology to market in Qualcomm chips, or which device makers Qualcomm is working with. “We haven’t announced anything yet. There’s clearly a lot of work to be done on it. We’re working on it we’re just not ready to announce,” he said. “We are very interested in in, that’s why we acquired the assets.”

He would say that Qualcomm is looking at both phone and tablet form factors for the ultrasound tech but added that it could work “anywhere” — including in wearable devices, such as Google Glass.

The system also doesn’t necessarily require new microphones to function — opening up the possibility of ultrasound-enabled accessories that can be retrofitted to existing devices to extend their capabilities.

“The other nice thing is that we find that the microphones [on existing mobile devices] that we put in to use for speech can also detect ultrasound waves — so you probably don’t need special microphones. There are lots of interesting ways to do it… You just need a transmitter somewhere,” said Talluri.

Discussing how mobile chipsets are generally going to evolve, Talluri said in his view the focus will be, not so much on on simply adding more and more cores, but rather on getting all the various chipset elements to work together better.

“We think the next generation of innovation is going to be more on heterogeneous compute. Right now if you look in the phone we’ve got CPUs, we’ve got GPUs, we’ve got video engines, we’ve got audio engines, we’ve got cameras, we’ve got security blocks but they all do one thing at a time.  Ideally you just want to say I want to do this and it should just go map itself to whatever its logical place is and if that place is busy it should work on something else, maybe not optimally,” he said.

“That’s what I mean by heterogeneous compute. Every block should be able to do other things so that’s kind of where I think SOC in general will evolve to. How can you take advantage of the silicon that you put inside the die to do multiple things, not just one thing at a time. I think that’s a more interesting concept than just put more cores.”

Qualcomm banishes LTE fragmentation with global RF360 radio: roaming ahoy!

LTE smartphones all but locked to specific carriers because they don’t support the profligate array of 4G frequencies in use could be a thing of the past, with Qualcomm promising its new RF360 radio chipset will play happily across 40 different bands. The Qualcomm RF360 Front End Solution can cope with all 40 of the different LTE frequenties carriers have deployed around the world, in addition to older HSPA+ and EVDO connections for when you’re outside of fledgling 4G coverage. Meanwhile, Qualcomm also promises that phones and tablets using the RF360 will be faster than their regular counterparts, as well as potentially smaller.

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That’s down to a selection of chips that are actually up to 50-percent smaller than the current models, despite adding in far more band support. Power consumption has also been reduced, with Qualcomm claiming up to a 30-percent saving, while heat output is also cut.

Radio performance takes advantage of Qualcomm’s new dynamic antenna matching tuner (QFE15xx), which is the first ever to be able to automatically adjust the antenna performance depending on environmental constraints and how the user is actually holding the device. Effective not only for 4G use but 2G/3G, across the 700-2700MHz bands, the new tuner works alongside an integrated power amplifier and antenna switch that’s easier to install and accomodate on tight circuit boards.

Finally, there’s the RF POP QFE27EE, a stacked chipset combining a multiband power amp and antenna switch, the SAW filters, and duplexes. It will be interchangeable, too, allowing for manufacturers to choose between creating devices that work on a smaller subset of LTE frequencies – such as for specific carriers or regions – or a broad, global-roaming LTE implementation.

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The huge increase in frequencies selected by 4G carriers worldwide has broken the market for devices down into an array of incompatible phones. Handsets like the iPhone 5, for instance, come in three different variants – outwardly identical, but with differing radio and antenna implementations – suited to different sets of networks, and the expectation that 3G device users had of being able to simply swap SIM cards and get up and running on a different carrier no longer applies.

For Qualcomm and manufacturers, meanwhile, the new RF360 radio is a way to simplify production: now a single SKU can be offered – potentially tailored by software and RF POP selection to suit the whims of carrier lock-down – rather than multiple iterations of the same device. The first products to use the RF360 Front End Solution will show up in 2013.


Qualcomm banishes LTE fragmentation with global RF360 radio: roaming ahoy! is written by Chris Davies & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

Finally, an LTE Chip That Will Work Anywhere in the World

Qualcomm has announced something that will make travellers everywhere very happy: a new radio chipset that can support every LTE network in the world. More »

Qualcomm outs global LTE chip, claims a world first

Qualcomm outs global LTE chip, claims a world first

Global flavors of LTE bands can be a hassle for travelers and firms making multiple versions of the same device, but Qualcomm says its solved that quandary with a new radio chipset. Dubbed the RF360, the silicon is hailed as the world’s first mobile chip that packs support for global LTE, which translates to connectivity for LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM / EDGE — breaking down the barriers separating roughly 40 different LTE bands. Not only does it lend globetrotters a hand, but Qualcomm claims the component carries a few other “world’s first” features that allow manufacturers to build thinner products with improved antenna performance, battery life and connection reliability. The outfit also unveiled the WTR1625L chip, which stakes claim to an industry first by sporting carrier aggregation alongside international LTE compatibility. Hardware made with the RF360 isn’t expected to arrive on shelves until the latter half of 2013, but for now you can mosey past the break for the nitty gritty details and a video to walk you through them.

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Qualcomm RF360 For Unified 4G LTE Smartphone Designs

Qualcomm RF360 For Unified 4G LTE Smartphone Designs

Qualcomm has announced RF360, a solution that solves one of the biggest hurdles for LTE handset makers and customers: the need to build multiple versions of the same handset to address one of the many (40+) LTE bands worldwide. Interestingly, Qualcomm did a good job of keeping this a secret, since the company hinted before that a solution to it may take a long time to appear. For instance, the iPhone 5 comes in 3 versions (Model A1428, A1429 GSM, A1429 CDMA) and the Galaxy S3 has multiple versions as well (including a Qualcomm-powered one). For the traveler, this meant that LTE will not be available outside of their home market, because each carrier uses different frequencies, and even within a local market (US: Sprint, Verizon, AT&T),  LTE roaming may not be available. You may care even if you do not travel because the different hardware flavors delay smartphones availability in smaller markets or for smaller carriers. It also fragments the smartphone support (different hardware) and finally, it makes building those phones more expensive to build, design and update. Qualcomm RF360 at offering a technical solution that would allow handset makers to build a single hardware design to address every (or most) LTE markets. (more…)

By Ubergizmo. Related articles: HTC One Hands-On (With HD Video), Samsung ATIV S Review,

Qualcomm announces new RF chips for thinner, more-powerful devices

Qualcomm today has announced the RF360 Front End Solution, which they claim “enables for the first time a single, global 4G LTE design for mobile devices.” The RF360 is actually a family of RF chips designed to eliminate the problem of band fragmentation while also improving RF performance — killing two birds with one stone. In turn, this helps phone makers manufacturer mobile devices that support all the major bands more easily than before. Plus, it’ll make future mobile devices thinner and more powerful.

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These RF chips also feature numerous industry firsts, including the first envelope power tracker for smartphones, as well as “a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and a 3D-RF packaging solution incorporating key front end components.” Essentially, these chips reduce power consumption and improve RF performance, while also reducing the size of the RF chips by up to 50% compared to current offerings, allowing for thinner devices.

The envelope power tracker inside the chip is designed to reduce power consumption by up to 30% and dissipate heat a lot better than previous-generation chips. The dynamic antenna matching tuner extends antenna range to operate over more frequency bands and spectrums, and the integrated power amp and antenna switch also has a smaller hardware footprint, and is the first of its kind to implement the power amp and antenna switch in one chip, allowing phone makers to develop thinner devices.

As for when we should expect new devices packing this new technology, Qualcomm says that devices featuring the complete Qualcomm RF360 Solution are expected to be launched sometime in the second half of this year. Of course, we’ll be at Mobile World Congress in just a few days, where we may hear more from Qualcomm at that time. Stay tuned.

[via Android Community]


Qualcomm announces new RF chips for thinner, more-powerful devices is written by Craig Lloyd & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

Qualcomm Announces Snapdragon 200 And 400 Chipset

 

Qualcomm Announces Snapdragon 200 And 400 Chipset

Qualcomm has announced the Snapdragon 200 and 400 series aimed at the lower-end market. This extends the new processor list for 2013 which now looks like this: the Snapdragon 200, 400, 600, 800. the 200 and 400 chipsets have been designed for  entry level devices. While the Snapdragon 800 and 600 processors are meant for high end smartphones. The newly announced Snapdragon processors are designed to provide better battery life, good performance performance and connectivity. Introduction of the new 200 and 400 chips aim that lowering the production cost of Android phones without compromising on the user experience for that price range. (more…)

By Ubergizmo. Related articles: AirGo Concept Makes Economy Class Flights More Comfortable, BT Tower Breaks World Record With A 320-Gigapixel Photo,

Qualcomm Quick Charge 2.0 revealed: power up quick!

With the introduction of their full 2013 (and beyond) lineup of processors for the mobile universe, Qualcomm had made it clear that they’re here not only to stay, but to bring on feature boosts like Quick Charge 2.0. With this second iteration of the feature many only discovered existed just about a week ago, you’ll be charging up to 75% faster than the competition. This means that if you’ve got your phone (with Quick Charge 2.0 technology inside), and your friend has their phone, and you’re both charging your devices at the same time, you’ll be going up to 75% faster than he or she – off to the races!

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There’s already a collection of Quick Charge 1.0 device out in the wild today, each of them working with Snapdragon processor. This is a Qualcomm technology, so you can expect many device to be working with it in the future as well. Many HTC devices in the past have been working with Quick Charge 1.0, and the HTC One is a device that’ll be busting out with Quick Charge 2.0 in the very near future. Quick Charge 2.0 comes embedded in all smartphones and tablets working with the next-generation Qualcomm Snapdragon 800 processor under the hood.

This technology resides in both the device and the AC/DC wall charger you’re using day to day. Qualcomm Quick Charge 2.0 is offered as a standalone IC solution (outside the Snapdragon 800) or as part of the Snapdragon 800 processor’s power management integrated circuit (PMIC). According to Qualcomm, devices they’d tested before Quick Charge 2.0 technology was embedded took 7 hours to charge compared to 3 hours after the switch.

The great thing about Quick Charge 2.0 is the fact that Qualcomm is working – right this minute – with AC/DC chipset suppliers to “fully enable the power supply ecosystem.” In other words, you’ll be using Quick Charge 2.0 and might not even know it. In addition, while Quick Charge 1.0 was made primarily for mobile devices, Quick Charge 2.0 will be ramping up to 60 watts of power when needed, both improving charge times for mobile devices and getting powerful enough to charge up notebooks, too.

Have a peek at the timeline below to see additional Qualcomm insights from the past week and get pumped up about Mobile World Congress 2013 and more Qualcomm action than you can handle. Hit up our Mobile World Congress 2013 tag portal for more information right this minute!


Qualcomm Quick Charge 2.0 revealed: power up quick! is written by Chris Burns & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

Qualcomm formally details lower-end Snapdragon 400 and 200 processors

Qualcomm formally details lowerend Snapdragon 200 and 400 processors

We knew way back at CES that Qualcomm had a few lower-end chips up its sleeve, but now it’s official: the Snapdragon 400 and 200 have been formally detailed in a company blog post thrown up today. Following in the footsteps of the high-end Snapdragon 800 and 600, these units are being aimed at “the mid-tier and entry level smartphone segments.” The 400 options include dual Krait CPUs running at up to 1.7GHz per core, quad ARM Cortex-A7 CPUs humming along at up to 1.4GHz per core, and an Adreno 305 GPU. You’ll also find support for TDSCDMA, DC-HSPA+ (42Mbps), 1x Advanced, W+G CDMA, and multi-SIM capabilities of Dual SIM, Dual Standby (DSDS) and Dual SIM, Dual Active (DSDA), as well as support for up 13.5 megapixel camera sensors, 1080p video capture / playback and Miracast wireless display tech. For the number nerds, Snapdragon 400 processors now include the following part numbers: 8226, 8626, 8230, 8630, 8930, 8030AB, 8230AB, 8630AB and 8930AB.

As for the 200, you’ll get quad ARM Cortex-A5 CPUs at up to 1.4GHz per core, an Adreno 203 GPU, HD video playback, GPS, LPDDR2 RAM, multi-SIM support and the ability to handle up to 8 megapixel camera sensors. Snapdragon 200 processors now include the following part numbers: 8225Q, 8625Q. Unfortunately, pricing is being kept under wraps, and it seems that Qually is going to leave it to its wondrous partners to actually announce new hardware that’ll be powered by its latest duo. With Mobile World Congress kicking off in a matter of days, something tells us you won’t have to wait much longer for the nitty-gritty.

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Source: Qualcomm

Qualcomm Snapdragon Voice Activation revealed with “always-on” action

This week Qualcomm has upped the ante with a selection of features for their next-generation chipsets for mobile devices. The most recent announcement is for Snapdragon Voice Activation, this technology built in to the Qualcomm Fluence PRO suite of the chipmakers’ integrated audio solutions. In simplest terms, this means you’ll soon be able to wake up your phone by saying “Hey Snapdragon” – this phrase set by whatever manufacturer decides to use the technology, of course.

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With Snapdragon Voice Activation, your smartphone will have the ability to have an “always on” feature so it’ll always be listening for your voice. That way whenever you want the phone to wake up and do things for you, you wont have to touch it at all. THis will be coming in the Snapdragon 800 series of processors and will be able to work even if your smartphone had been in airplane mode, standby, or a variety of sleep modes.

Connecting with the smartphone (or tablet)’s/HLOS voice natural user interface, you’ll be working with your phone without a tap in the very near future. This solution has been pushed by Qualcomm as a secure and low-power feature that’ll be able to work only with the voice of the owner of the device. Of course if you’ve got a twin that’s got the same voice modulation as you, you might be in for a surprise – but what are the odds?

Qualcomm is also making it clear this week that “over 55 Snapdragon 800-powered devices” are already in development. That means one whole heck of a lot of mega-powerful smartphones and tablets over the next few months. Can’t wait!

Have a peek at the timeline below for more Qualcomm action as we ramp up to Mobile World Congress 2013 starting in less than a week!


Qualcomm Snapdragon Voice Activation revealed with “always-on” action is written by Chris Burns & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.