Hasta La Gadget!

We never thought our day could get any better after Huawei’s Consumer Business Group CEO Richard Yu became available again for our CES stage interview (there was originally a “last minute urgent conflict”), but our man was also kind enough to share a couple more scoops with us. First of all, Huawei will be joining Samsung at the octa-core Cortex-A15 party in the second half of this year, and given what Yu’s told us earlier this week, our guess is that this will either be the HiSilicon K3V3 or a sister chipset, again manufactured by TSMC.

The second scoop of the day was delivered fresh off the stage after the interview. Yu told us exclusively that at MWC next month, Huawei will be unveiling a super slim follow-up to the current P series Android phones. We asked if it’ll be even thinner than 6.45mm (the thickness of the Alcatel One Touch Idol Ultra announced at CES), and Yu said yes. The exec added that the new phone will have a beautiful metallic body as well. Exciting times, right?

Filed under: Cellphones, Mobile

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Via: Engadget Chinese

Earlier today our brethren over at Engadget Chinese got to hang out with Huawei Device chairman Richard Yu, who was kind enough to inform us that his company will release a HiSilicon K3V3 chipset — the follow-up to the current quad-core K3V2 — in the second half of this year. What’s more, much like NVIDIA’s upcoming Tegra 4, the new platform will be based on the more powerful Cortex-A15 ARM architecture instead of Cortex-A9. Yu also hinted that the K3V3 will be featured in the successors to the Ascend D2 and the Ascend Mate, but our guess is that we won’t be seeing those at MWC next month. We shall tickle the man live on stage for more answers this Thursday.

Filed under: Misc, Mobile

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