Apple reportedly clinches TSMC chip manufacturing deal

Apple reportedly clinches longsought TSMC manufacturing deal

Rumors of Apple switching its chip manufacturing from Samsung to TSMC have persisted for a long, long time. However, they may be more substantial this time around: the Wall Street Journal claims that Apple quietly signed a deal with TSMC earlier this month. The agreement reportedly has TSMC taking over some of Apple’s chip production in 2014. Technical setbacks kept the agreement from happening any sooner, according to the sources. Neither company is commenting on the accuracy of the story, although few would doubt Apple’s incentives to reduce its dependency on Samsung-made silicon — it’s not keen on funding a primary competitor.

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Source: Wall Street Journal

Apple Is Finally Going to Ditch Samsung’s Chips

Apple Is Finally Going to Ditch Samsung's Chips

The Wall Street Journal is reporting that Apple has finally signed a deal with something called Taiwan Semiconductor Manufacturing Co to make its guts for future iPhones and iPads. Specifically, TSMC will start mass-producing 20 nanometer chips for Apple in 2014, paving way for longer battery life in Samsung-less iPhones and iPads.

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TSMC 20nm Production Of Apple A8 Processor Begins Next Month [Rumor]

According to a new report Apple has roped in TSMC for three years to develop its 20nm A8, 16nm A9 and 10nm A9X processors for next generation iOS devices.

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TSMC narrows production of 16nm FinFET chips to late 2013, wants 10nm in 2015

FinFET chip

For as often as TSMC has extolled the virtues of FinFET chip designs, we’ve been wondering exactly when we’d find them sitting in our devices. Thanks to competition from rival semiconductor firms, we’ll get them relatively soon: the company now expects to produce its first wave of FinFET-based, 16-nanometer chips toward the end of 2013. While they won’t be as nice as 14nm-XM chips in the pipeline, the 16nm parts should still offer battery life and speed improvements over the 28nm chips we know today. These improvements also won’t be the end of the road — TSMC anticipates 10nm designs built on extreme ultraviolet lithography late into 2015, and CEO Morris Chang believes there’s seven or more years of advancements in manufacturing before Moore’s Law starts breaking down. We’ll just be happy if we see FinFET reach our phones and tablets in the near term.

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Via: Phone Arena

Source: EETimes

Apple’s A7 Chip Could Be Built By TSMC Once Contract With Samsung Expires [Rumor]

Apples A7 Chip Could Be Built By TSMC Once Contract With Samsung Expires [Rumor]We’ve all heard the rumors at how Apple is looking to reduce their dependence on Samsung for their components, namely Apple’s AX chipset which is currently being manufactured by the South Korean company. This is due to an ongoing lawsuit between both companies in which both sides allege that the other party has infringed upon one of their patents. Regardless, a fresh set of rumors has emerged and according to Taiwan’s Economic Daily News, they claim that Apple’s contract with Samsung is coming to an end and that Apple has no plans to renew it.

Instead the manufacturing of Apple’s rumored A7 chipset will go to none other than TSMC who will be building the chipset on a smaller 20nm process in 2014 and will find its way into the iPhone 6. Assuming this is true, the implications of this means that Apple’s rumored iPhone 5S, scheduled for release later this year, will not come with the newer A7 chipset, and we could instead be looking at the A6X which debuted in the iPad 4. We’ve heard all sorts of rumors regarding Apple’s choice of manufacturers for their chipset, ranging from TSMC to possibly even Intel, so take this with a grain of salt for now.

By Ubergizmo. Related articles: US Department Of Defense Reportedly Planning On Buying 650,000 iOS Devices, Apple said to have turned to Intel for manufacturing of their mobile chipsets [Rumor],

First ARM Cortex-A57 processor taped out by TSMC, ready for fab

ARM CortexA57 processor taped out, ready for fab

Your current smartphone just took another spin backwards on the obsolescence cycle thanks to a new landmark from ARM and TSMC: the first Cortex-A57 has reached the “tape out” stage, meaning it’s ready for mass production. The new chip will use TSMC’s 16nm FinFET technology (though the transistors will be 20nm for the A57) and will bring up to three times the CPU power of current chips for the same battery life — or a maximum of five times the battery life at the same speed. The companies said they ramped the chip from design to tape out in a mere six months, though there’s no timetable for its arrival in specific devices. When it does start hitting next gen phones and slates though, expect the performance charts to get singed.

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HTC and TSMC talks tipped for Panasonic smartphone buy-out

Panasonic isn’t just looking to get out of the plasma TV business but to shed its little-loved smartphone division too, Japanese reports claim, with HTC and chip fab TSMC tipped as potential bedfellows for the mobile team. Having seen its ELUGA range of waterproof phones fail to gain traction, Panasonic is considering shedding the ailing division altogether, the Sankei Shimbun reports, with insiders pointing to some unexpected interest.

panasonic_eluga_hands-on_sg_2

HTC requires little introduction in the smartphone business, though its fortunes have been slightly less rosy over the past eighteen months. The company faces its own struggles right now, with problems securing sufficient components for its new flagship One and thus meeting its own launch schedule.

TSMC, however, is perhaps less well known. Taiwan Semiconductor Manufacturing Company, Limited, is actually the biggest dedicated independent semiconductor foundry, with clients including Apple, Qualcomm, and NVIDIA for its chipset production.

What use, however, it might have with Panasonic Mobile Communications is unclear, though the company continues to provide devices for the main carriers in the Japanese market. It also produces base-station and infrastructure equipment, which could be potential recipients for TSMC SoCs.

The HTC connection is more obvious, and HTC has had some recent success in the Japanese market with the J Butterfly (the local version of the DROID DNA) which could have whet its appetite for more. We asked HTC for a statement, but the company told us it does not comment on rumor and speculation.

Discussions between the three firms are supposedly ongoing, the Japanese paper claims, though price and a commitment to retaining the workforce are supposedly the key thorns in negotiations. Panasonic had hoped to broaden its smartphone footprint by returning to the European market in 2012, after withdrawing back to Japan-only sales in late 2005.

[via Unwired View]


HTC and TSMC talks tipped for Panasonic smartphone buy-out is written by Chris Davies & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

Apple’s A7 Chipset Reportedly Being Manufactured By TSMC

Apples A7 Chipset Reportedly Being Manufactured By TSMCIt has long been rumored that Apple is looking to move away from Samsung as the manufacturer of their AX chipsets, and if the reports are to be believed, Apple’s A7 chipset could be made by TSMC. It is unknown if all of the A7 chipsets will be handled by TSMC (rumors suggest that 10% could be made by Intel), or if only a portion of it as Apple gradually reduces reliance on Samsung, but the report by Digitimes has indicated that TSMC is ready to “tape out” (the photomasking process which is one of the final steps in circuit design) the A7 chip on its 20nm process. Assuming that is the case, risk production is expected to begin in either May or June and full production will kick off in 2014, suggesting that Apple products with the A7 chipset will only debut next year. This is not too surprising given that TSMC’s 20nm manufacturing process is only expected to be ready in 2014.

By Ubergizmo. Related articles: Analyst Predicts Retina iPad Mini To Launch Q3/Q4 2013, Yellow/Gold iPhone 5S In The Works?,

Apple A7 chip tipped with Intel inside

With the pattern ringing true for some time now, it’s not unbelievable in the slightest when one hears a tip of a so-called “A7″ chip in Apple’s future for the iPad, iPhone, and iPod touch. What’s slightly more questionable is the possibility that part of the production of this chip might be done by Intel. With word of Apple aiming to pull away from Samsung in their chip production across the board having been an unofficial understanding for quite a few months now, it seems that Intel might be aiming to grab a piece of the pie.

apple_a5_cpu-580x325

This news comes from DigiTimes – a publication which you’ll certainly want to take some measure of salt listening to – speaking with unnamed “institutional investors.” The note speaks of Apple’s business aiming for Intel with an approximate 10% chop of the market in creating this next-generation mobile SoC. As for the rest of the pie, a rumor persists that TSMC – Taiwan Semiconductor Manufacturing Company – will be rolling in the production.

The newest break-up of production, again according to DigiTimes, is a 50/40/10 sharing of efforts, with Samsung keeping the largest slice while TSMC takes the 40 and Intel takes the 10. In the end, the A7 chip will remain Apple-branded and, unlike smartphones made by most other major manufacturers, the processor inside the iPhone, iPad, and iPod touch will only be promoted as Apple-made. We’ll have to wait until the tear-down and magnifying glass up-close looks to be sure.

Have a peek at the timeline below to see more information on what Apple’s A-series chips have been up to, and stick around later this year to hear all about what’s almost certainly going to be the iPhone 5S, too. Is it time for the A7 chip to go much more than multi-core? Quite possibly!

[via DigiTimes]


Apple A7 chip tipped with Intel inside is written by Chris Burns & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

TSMC to triple 28nm chip shipment this year, asserts confidence in 20nm demand

TSMC to triple 28nm chip shipment this year, asserts confidence in 20nm demand

At yesterday’s investor meeting in Taipei, TSMC’s chairman and CEO Morris Chang shared the good news that his company’s 28nm chip shipment this year will triple that of last year, which should boost its annual increase in revenue to above the industry’s average rate of seven percent. China Times reports that orders for TSMC’s 28nm silicon are lined up to as far out as late Q3, courtesy of demand for ARM processors, baseband chips, graphics processors and x86 processors. This is no surprise considering the likes of Qualcomm (Snapdragon 600 and 800), Huawei (HiSilicon K3V2 Pro and K3V3), NVIDIA (Tegra 4), AMD (Temash and Kabini) and possibly Apple will be ordering more 28nm-based chipsets from the foundry throughout the year. TSMC did struggle with its 28nm supply for Qualcomm early last year, but it eventually caught up later on, and Chang stated that TSMC now owns nearly 100 percent of the 28nm process market.

Looking further ahead, Chang said his company’s already seen enough clients and demand for the upcoming 20nm manufacturing process, which should have a more significant financial contribution in 2014. The exec also predicted that at TSMC, its 20nm production will see a bigger growth rate between 2014 and 2015 than its 28nm counterpart did between 2012 and 2013 — the former should eventually nab close to 90 percent of the market, said Chang.

[Image credit: TSMC]

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Via: The Next Web

Source: China Times (translated), MoneyDJ (translated)