AMD hUMA wants to speed your APU memory use, no joke

Heterogeneous Uniform Memory Access may sound like the orderly queue you make outside the RAM store, but for AMD, hUMA is an essential part of squeezing the best from its upcoming Kaveri APUs. Detailed for the first time today, hUMA builds on AMD’s existing Heterogeneous System Architecture (HSA) – integrating CPUs and GPUs into single, multipurpose chips – by allowing both the core processor and the graphics side to simultaneously access the same memory at the same time.

amd_kaveri_apu_huma

That’s important, since currently the CPU and GPU on an APU have to wait for time-consuming memory block management to take place in order for both parts to access it. If the GPU wants to see the same data that the CPU is seeing, that data has to be replicated in two places.

hUMA, however, would do away with that copying process, since it would make the memory visible to both CPU and GPU simultaneously. Called bi-directional coherent memory, it will mean less time involved for both halves of the APU to track data changes, as well as introduce efficiencies in memory management, since they’ll have a better understanding and control over what free memory there is, and what they can use at any one time.

The upshot is systems that take less time for processing, as well as software that’s easier to code since developers won’t need to consider memory block management when they’re trying to integrate GPU acceleration. Instead, that will all be handled dynamically by the hUMA system.

The first evidence of hUMA in the wild will be AMD’s upcoming APU refresh, codenamed Kaveri. Revealed back at CES, full details on Kaveri are unknown, but the APU will be a 28nm chip and is tipped to include up to four of AMD’s Steamroller cores, Radeon HD 7000 graphics, and a 128-bit memory controller with support for both DDR3 and GDDR5 memory.

AMD expects to have its Kaveri APUs on the market in the second half of 2013.

[via Notebook Review; via HotHardware]


AMD hUMA wants to speed your APU memory use, no joke is written by Chris Davies & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

Qualcomm Snapdragon 800 Mass Production Begins Next Month

Qualcomm Snapdragon 800 Mass Production Begins Next Month

The Qualcomm Snapdragon 800 processor was first revealed back at CES 2013. It is a quadcore chip that utilizes Qualcomm’s new Krait 400 CPU designed with 28nm process and optimized for frequencies as high as 2.3Ghz. It has a Adreno 330 GPU on board which supports 4K playback at 30 frames per second. The company has now announced that Snapdragon 800 processor enter mass production next month.

The Qualcomm 600 has already proved to be successful, with manufacturers such as Samsung and HTC both opting for it to power their latest high-end flagship smartphones. Snapdragon 600 is appreciated largely for its amazing performance and power consumption. With all four cores clocked asynchronously, the Snapdragon 800 is similar to the 600, besides the fact that it touts clock speed of 2.3Ghz, a better GPU and is expected to be more power efficient. The confirmation about mass production of its next processor was made by Qualcomm in Beijing, it begins towards the end of May. There’s no doubt that some phenomenal mobile devices will be powered by this upcoming processor, however the company is tight-lipped about the devices that will tout the Qualcomm Snapdragon 800.

By Ubergizmo. Related articles: Google Officially Acquires Wavii Resulting In Shutdown Of App, Apple’s WWDC Starts On June 10 With Focus On iOS 7, OS X,

    

Intel confirms 4th gen ‘Haswell’ processor to appear at Computex

We all knew this was coming, but today it’s now official. The folks from Intel took to their social network channels to tease a countdown to their next Intel Core processors. The 4th generation chip that’s known as ‘Haswell’ that will be powering laptops, ultrabooks and hybrid portable devices moving forward. That countdown ends this summer on June 3rd.

Screen Shot 2013-04-26 at 7.08.24 PM

Posting the image you see above to Twitter, Intel teases that in approximately 3,337,200,000,000,000 nanoseconds Intel will reveal their hotly anticipated 4th gen Intel Core processor to the world. Basically right at the beginning of Computex 2013, where we’ll see loads of Haswell powered hybrid PCs and more.

Haswell hasn’t been much of a secret, and earlier this month we confirmed Intel had already started shipping Haswell to an array of PC manufacturers. Haswell promises to bring a major boost in performance and more importantly battery life over Ivy-bridge for all those ultra-portables.

Around the same time we are also expecting to see Windows Blue show its face, so this years Computex is looking to be a pretty exciting event. We all knew the chip was coming but now all you enthusiasts can circle a time around June 3rd on your calendar and start getting ready for the onslaught of Haswell based systems. We could even see a few Android-based systems too, so stay tuned.

[via CNET]


Intel confirms 4th gen ‘Haswell’ processor to appear at Computex is written by Cory Gunther & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

AMD reveals G-Series X embedded chips, drops a little ARM-powered bombshell

AMD reveals G Series embedded chips, drops an ARMpowered bombshell in the process

We’re no strangers to AMD’s embedded processors, designed for specialist applications such as casino gaming and dashboard infotainment systems. But this latest announcement of an updated G-Series processor reveals something totally unexpected. It’s not just that the chip contains four Jaguar cores of PlayStation 4 fame, or that it also includes a Radeon 8000 GPU and I/O module on a single piece of silicon — although that’s all interesting enough. The key thing is actually the “X” in the lower right corner of the logo, which signifies that this is an x86 chip of the type we’d normally expect from AMD. The question is this: Why bother even mentioning the “X” when everyone knows AMD is an x86 stalwart already? Read on and we’ll explain its true significance.

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TSMC narrows production of 16nm FinFET chips to late 2013, wants 10nm in 2015

FinFET chip

For as often as TSMC has extolled the virtues of FinFET chip designs, we’ve been wondering exactly when we’d find them sitting in our devices. Thanks to competition from rival semiconductor firms, we’ll get them relatively soon: the company now expects to produce its first wave of FinFET-based, 16-nanometer chips toward the end of 2013. While they won’t be as nice as 14nm-XM chips in the pipeline, the 16nm parts should still offer battery life and speed improvements over the 28nm chips we know today. These improvements also won’t be the end of the road — TSMC anticipates 10nm designs built on extreme ultraviolet lithography late into 2015, and CEO Morris Chang believes there’s seven or more years of advancements in manufacturing before Moore’s Law starts breaking down. We’ll just be happy if we see FinFET reach our phones and tablets in the near term.

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Via: Phone Arena

Source: EETimes

Intel offers new details on Atom SoC and Xeon processors

intel-logoNew details have turned up about some the new Intel processor families during the Intel Developer Form in Beijing, China. Intel offered details on its Atom SoCs for the data center when it launched the processors back in December of 2012. At the time, the processors including the S1200 product family representing the world’s first 64-bit SoC for servers operating at 1.6 to 2.0 GHz.

Intel has now unveiled details on three new low-power SoCs aimed at the data center that will be coming this year. The new products are for the data center will be in the Intel Atom Processor S12x9 product family for storage. These product will share several features with the S1200 SoC family, but will be tweaked specifically to support storage devices.

The S12x9 family will feature up to 40 lanes of integrated PCI Express 2.0 or physical paths between I/O and the processor. They will support hardware RAID storage acceleration and provide NTB failover support. In the second half of 2013, the 64-bit 22 nm processor for micro servers code-named Avoton will debut featuring an integrated Ethernet controller. Also available in the second half of 2013 will be a new Atom SoC code-named Rangeley promising energy efficient mechanism for processing communications workloads aimed at the entry to mid-level routers, switches, and security appliances.

Intel is also talking up some new Xeon processors including the E3, E5, and E7 families. The E3 1200 v3 product family is based on the Haswell architecture and promises to improve performance for video analytic workloads and to support improved transcode performance. The lowest TDP processor in this family will be 13 W for 25% power savings compared to the prior generation. The E5 family will be based on the 22nm manufacturing process and available in Q3 promising improved security and more. Intel’s E7 processor family will be available in Q4 2013 supporting three times the memory capacity for up to 12 TB in eight-socket node.

The E7 will also include Intel’s Run Sure Technology to deliver greater system reliability and increased data integrity on minimizing downtime for mission-critical workloads. The chip will also feature Resilient System Technologies with standardized technology for processor, firmware, and software layers to allow the system to recover from previously fatal errors. The processor family will also support Resilient Memory Technologies to ensure data integrity and allow systems to run reliably over longer periods of time. Interestingly, the Mac Pro family uses Xeon processors and rumors have been circulating that a refresh of the Mac Pro line is inbound. That refresh makes sense with Intel having new processors on the horizon.

[via Intel]


Intel offers new details on Atom SoC and Xeon processors is written by Shane McGlaun & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

First ARM Cortex-A57 processor taped-out

arm-logoARM and TSMC have announced that they have completed the tape-out of the first ARM Cortex-A57 processor. The processor was taped-out on TSMC’s 16nm FinFET technology. ARM says that this new processor is its highest performing and is designed to extend the capabilities of future mobile and enterprise computing devices.

The processor will eventually find its way into high-end computer, tablet, and server products according to ARM. TSMC and ARM say that this is the first milestone in the cooperation between the two companies to optimize the 64-bit ARMv8 processor series using the FinFET process technology. From RTL to tape-out of the new processor was completed in six months according to the companies.

During the process, ARM and TSMC used ARM Artisan physical IP, TSMC memory macros, and RDA technologies that were enabled by the TSMC Open Innovation Platform design ecosystem. Through the collaboration between the two companies optimized, power efficient Cortex-A57 processors and libraries were created to support early customer implementations on 16nm FinFET for high-performance ARM-based SoCs.

Neither of the two companies have offered details on when we might expect to see Cortex-A57 processor equipped devices come to market. One interesting tidbit about TSMC is that the company produced 15.1 million 8-inch equivalent wafers in 2012. The company is the world’s largest dedicated semiconductor foundry.

[via ARM]


First ARM Cortex-A57 processor taped-out is written by Shane McGlaun & originally posted on SlashGear.
© 2005 – 2012, SlashGear. All right reserved.

AMD roadmap shows Steamroller-based Opterons on track for 2013

AMD roadmap puts Steamroller chips on track for 2013

AMD gave us a tease of its next-generation Steamroller architecture in 2012, but things weren’t looking good for pro users when the initial timeline had current-generation Piledriver technology as the focus for Opterons in 2013. Thanks to a newer investor presentation, there’s a glimmer of hope for the workstation and server users among us. Its roadmap shows Steamroller-equipped Opteron variants arriving this year, with an Excavator follow-up coming at an undetermined point in the future. There’s nothing about specific timelines and models, as you might imagine — AMD isn’t going to spoil its plans quite so readily — but the presentation reminds us that Steamroller will put an emphasis on the parallelism that’s oh so vital to high-end computing. We’re mostly glad to hear that IT backrooms will have something genuinely new to play with while we’re off enjoying its Kaveri counterpart at home.

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Via: X-bit Labs, TechEye

Source: AMD (PDF)

Samsung Exynos Octa now rocking LTE, destined for Korean market

Samsung Exynos Octa now rocking LTE, destined to Korean market

When Samsung’s Exynos 5 Octa was announced, it was believed to be compatible with 3G networks only. As such, the HSPA+ (global) version of the Galaxy S 4 was the only handset to feature the company’s eight-core SoC — the LTE model shipping with Qualcomm’s 4G-capable, quad-core Snapdragon 600 instead. That’s apparently changed, with the Korean giant tweeting that the Exynos 5 Octa now supports LTE on 20 bands. So why even make a Snapdragon 600 version of the Galaxy S 4, then? Perhaps Samsung can’t produce as many chips as Qualcomm to meet the upcoming worldwide demand for its new flagship. This appears likely, with inews24 and new-samsunggalaxys4 reporting that the Exynos 5 Octa with LTE is currently reserved for Korean models only (SHV-E300S, SHV-E300K and SHV-E300L, to be exact). So, anyone fancy a trip to Seoul in the near future?

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Via: GSMArena

Source: SamsungExynos (Twitter)

IBM turns metal oxides into non-volatile chips through liquid currents

IBM technique turns metal oxides into nonvolatile memory through liquids

IBM is worried that we’re reaching the end of the road for CMOS technology — that we need new materials beyond silicon to keep the power draw down in chips as their performance goes up. It may keep future circuitry extra-lean through a new technique that puts a metal oxide in silicon’s place and allows for non-volatile processors and memory. By running ionized liquid electrolytes in currents through the oxide, the company can switch that oxide from an insulator to a conductor (and vice versa) that can reliably maintain its state, even when there’s no power. The trick would let a logic gate or switch kick into action only when there’s an event, rather than needing constant jolts of electricity — and without the pressure or temperature changes that had ruled out metal oxides for chips in the past. We’re still far from replacing silicon with more efficient oxides given the early state of IBM’s work, but having a consistent method is an important first step.

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Source: IBM