Seed-sized A*STAR antenna could open the door to 20Gbps wireless

Seedsized ASTAR antenna could open the door to 20Gbps wireless

Antennas have often capped the potential speed of a wireless link — the 450Mbps in modern 802.11n WiFi routers is directly linked to the use of a MIMO antenna array to catch signals more effectively, for example. That ceiling is about to get much higher, if A*STAR has anything to say about it. The use of a polymer filling for the gaps instead of air lets the Singapore agency create a 3D, cavity-backed silicon antenna that measures just 0.06 by 0.04 inches, roughly the size of a seed on your hamburger bun, even as it increases the breakneck pace. The new antenna generates a signal 30 times stronger than on-chip rivals at an ultrawideband-grade 135GHz, and musters a theoretical peak speed of 20Gbps — enough that 802.11ac WiFi’s 1.3Gbps drags its heels by comparison. Before we get ahead of ourselves on expecting instant file transfers at short distances, there’s the small matter of getting a chip that can use all that bandwidth. Even the 7Gbps of WiGig wouldn’t saturate the antenna, after all. Still, knowing that A*STAR sees “immense commercial potential” in its tiny device hints that wireless data might eventually blow past faster wired standards like Thunderbolt.

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Seed-sized A*STAR antenna could open the door to 20Gbps wireless originally appeared on Engadget on Wed, 29 Aug 2012 00:32:00 EDT. Please see our terms for use of feeds.

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Acronym-loving Samsung joins Intel and TSMC, buys stake in ASML

Samsung joins Intel and TSMC, buys stake in chipmaker ASML

Samsung’s round of cash-flashing continues with a $629 million purchase of a three-percent stake in ASML. It’s joining Intel and TSMC in pumping money into the Dutch business, developing tooling for chip-making machines with Extra Ultraviolet Lithography (EUV) designed to “extend Moore’s Law.” It’ll also help reduce the cost of future silicon, since it’ll enable the companies to use wider silicon wafers along the manufacturing line. Given that Samsung’s investment caps of a project to raise nearly $5 billion in cash and that ASML’s home is just five miles west of PSV Eindhoven’s stadium, we just hope they threw in a few home tickets for their trouble.

Continue reading Acronym-loving Samsung joins Intel and TSMC, buys stake in ASML

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Acronym-loving Samsung joins Intel and TSMC, buys stake in ASML originally appeared on Engadget on Mon, 27 Aug 2012 06:44:00 EDT. Please see our terms for use of feeds.

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Harvard makes distortion-free lens from gold and silicon, aims for the perfect image (or signal)

Harvard makes distortionfree lenses from gold and silicon, aims for the perfect image or signal

Imaging has been defined by glass lenses for centuries, and even fiber optics haven’t entirely escaped the material’s clutch. Harvard’s School of Engineering and Applied Sciences might have just found a way to buck those old (and not-so-old) traditions. A new 60-nanometer thick silicon lens, layered with legions of gold nanoantennas, can catch and refocus light without the distortion or other artifacts that come with having to use the thick, curved pieces of glass we’re used to — it’s so accurate that it nearly challenges the laws of diffraction. The lens isn’t trapped to bending one slice of the light spectrum, either. It can range from near-infrared to terahertz ranges, suiting it both to photography and to shuttling data. We don’t know what obstacles might be in the way to production, which leads us to think that we won’t be finding a gold-and-silicon lens attached to a camera or inside a network connection anytime soon. If the technology holds up under scrutiny, though, it could ultimtately spare us from the big, complicated optics we often need to get just the right shot.

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Harvard makes distortion-free lens from gold and silicon, aims for the perfect image (or signal) originally appeared on Engadget on Sat, 25 Aug 2012 00:00:00 EDT. Please see our terms for use of feeds.

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ARM and Globalfoundries hammer out deal to promote 20nm mobile chips

ARM and Globalfoundries hammer out deal to promote 20nm mobile chips

Sure it’s British, but ARM’s mobile empire is being built through careful alliances rather than conquest. The chip designer’s latest deal with Globalfoundries, which mirrors a very similar agreement signed with rival foundry TSMC last month, is a case in point. It’s designed to promote the adoption of fast, energy-efficient 20nm processors by making it easy for chip makers (like Samsung, perhaps) to knock on Globalfoundries’ door for the grunt work of actually fabricating the silicon — since the foundry will now be prepped to produce precisely that type of chip. As far as the regular gadget buyer is concerned, all this politicking amounts to one thing: further reassurance that mobile processor shrinkage isn’t going to peter out after the new 32nm Exynos chips or the 28nm Snapdragon S4 — it’s going to push on past the 22nm benchmark that Ivy Bridge already established in the desktop sphere and hopefully deliver phones and tablets that do more with less juice.

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ARM and Globalfoundries hammer out deal to promote 20nm mobile chips originally appeared on Engadget on Mon, 13 Aug 2012 10:16:00 EDT. Please see our terms for use of feeds.

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Intel to buy 15 percent of silicon fab equipment maker ASML, wants manufacturing machines made faster

Intel to buy 15 percent of silicon lithography equipment maker ASML, wants chip fab machines made more quickly Chipzilla didn’t get its position as the king of semiconductors by twiddling its thumbs, folks. It became a Valley behemoth by delivering us faster and better silicon, and its latest $4.1 billion purchase — a 15 percent stake in silicon manufacturing equipment maker ASML Holding NV — should help keep Intel atop the CPU heap. You see, Intel’s in the process of retooling its chip manufacturing process to use bigger diameter silicon wafers, which’ll make those Ivy Bridge, ValleyView and other future chips cheaper for all of us. Such retooling can take years to implement, which is likely why Intel was willing to plunk down so much cash to ensure nothing futzes with its manufacturing timetable. The company’s investment will presumably give it the clout to get ASML’s crucial lithography equipment on the fast track to completion. Hop to it, fellas, we want our CPUs at bargain-basement prices, and we want them now.

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Intel to buy 15 percent of silicon fab equipment maker ASML, wants manufacturing machines made faster originally appeared on Engadget on Tue, 10 Jul 2012 01:05:00 EDT. Please see our terms for use of feeds.

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Researchers partially automate CPU core design, aim to fast track new PC processor production

NC State researchers automate CPU core design, potentially put new PC processors on the production fast trackTired of the year wait (or more) in between new silicon architecture offerings from Chipzilla and AMD? Well, if some Wolfpack researchers have anything to say about it, we’ll measure that wait in months thanks to a new CPU core design tool that automates part of the process. Creating a new CPU core is, on a high level, a two step procedure. First, the architectural specification is created, which sets the core’s dimensions and arranges its components. That requires some heavy intellectual lifting, and involves teams of engineers to complete. Previously, similar manpower was needed for the second step, where the architecture spec is translated into an implementation design that can be fabricated in a factory. No longer. The aforementioned NC State boffins have come up with a tool that allows engineers to input their architecture specification, and it generates an implementation design that’s used to draw up manufacturing blueprints. The result? Considerable time and manpower savings in creating newly designed CPU cores, which means that all those leaked roadmaps we’re so fond of could be in serious need of revision sometime soon.

Researchers partially automate CPU core design, aim to fast track new PC processor production originally appeared on Engadget on Wed, 27 Jun 2012 07:58:00 EDT. Please see our terms for use of feeds.

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