Dec 28
The 2013 Mac Pro has a removable CPU, Other World Computing has discovered in a teardown. By “removable”, we mean the CPU can be pulled out of its socket by … Continue reading
Aug 15
Benchmarks for the 2013 model Mac Pro surfaced back in June. At the time there was some mixed opinions in terms of those results. The Geekbench test had returned a score of 23,901 and while that was roughly 2,000 points above the previous Mac Pro flagship — some were expecting much higher numbers based on […]
Jul 23
With the release of HP’s next-generation workstations in the HP Z230 Tower and SFF, the company brings a combination of compact bodies and energy efficient constructs to keep them current in today’s business environment. The HP Z230 comes in two main configurations, both of them with a set of possible configurations therein. Both units are being pushed at the same time as a series of Z Displays that’ll compliment their next-generation abilities.
The HP SFF (Small Form Factor) works with a body that’s a full 57% smaller than the Tower that shares its name. You’ve got a single 3.5-inch internal bay here, 1x 2.5-inch bay to keep it company inside, and a single internal/external 3.5-inch bay to boot. And just in case you need another, you’ve also got a single external Half-Height 5.25-inch bay as well. Expansion slots on this machine include 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 slot/x16 connector, 1 PCIe Gen2 x1 slot/x4 connector, and 1 PCIe Gen2 x1 slot, the whole lot of the Low Profile.
With the Tower you’ll get six available drive bays, one of which is a versatile 2.5-inch HD bay for high speed solid state drive integration, along with optional external slim ODD bay. This optional bay allows rather easy installation of SSD Hard Drives for quick-changes and expansion. Expansion on this machine includes 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 slot/x16 connector, 1 PCIe Gen2 x1 slot/x4 connector, 1 PCIe Gen2 x1 slot, and 1 PCI 32-bit.
Both of these devices work with 2x USB 3.0 ports up front alongside at least one USB 2.0 port and a headphone out. The Tower adds a single microphone in and a second USB 2.0 Charging Data Port. Both machines have 2 USB 3.0 ports on their back, 4 USB 2.0, and a variety of Display Ports – they’ve both got 1x USB 3.0 inside, these joined by 3 USB 2.0 ports under the hood as well.
The Tower in this family rings in at 15.7 x 6.7 x 17.4 in (39.93 x 17.04 x 44.25 cm) while the SFF is just 3.95 x 13.3 x 15.0 in (10.5 x 33.83 x 38.15 cm). Both work with Intel’s newest Xeon processor E3-1200 v3 family with choices for either 2D or 3D graphics. These units start at $999 USD for quad-core configurations and are expected to be available worldwide inside August of this year.
HP Z230 Tower and SFF Workstation designed for expansion is written by Chris Burns & originally posted on SlashGear.
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Jun 20
Mac Pro 2013 benchmarks leak
Posted in: Today's ChiliApple’s new Mac Pro 2013 may not be on sale yet, but that hasn’t stopped the compact new workstation from cropping up in benchmarks and, in the process, giving us a hint of its Xeon E5-powered performance. A listing supposedly for the new Mac Pro – which Apple gave us a sneak peak of at
Jun 04
WWDC 2013: the rumor roundup
Posted in: Today's Chili
It’s that special time for Apple devotees: WWDC 2013 is next week, and that means a customary glimpse of where iOS and the Mac are going next. However, we’re getting everything but business as usual this year. The crew at 1 Infinite Loop has shaken up its software strategy, putting much of its emphasis on Jony Ive’s design chops and tighter collaboration between teams. Is Apple about to deliver major OS refreshes that some say are long overdue? And what about hints of new hardware introductions at the same time? We’ve gathered together some of the more notable rumors to help understand what Apple may introduce on June 10th — and what’s likely to remain wishful thinking.
Filed under: Cellphones, Desktops, Laptops, Tablets, Software, Mobile, Apple
Apr 09
Truth be told, not much has been announced on the consumer end at IDF Beijing earlier today, but Intel did tease us with upcoming refreshes of its Xeon E7, E5 and E3 families for the enterprise space. In chronological order we have the Haswell-based E3 with TDP as low as 13W, and it’s coming in mid-2013. This is followed by the “Ivy Bridge-EP” E5 in Q3 and then the “Ivy Bridge-EX” E7 series in Q4, the latter of which boasting three times the memory capacity of its predecessor, along with Intel’s Run Sure reliability feature. More details in the press release after the break if you’re into these flavors of chips.
Also mentioned at the keynote were the now-available Atom S12x9 family for storage systems, as well as a couple of upcoming 22nm 64-bit Atom SoCs codenamed “Avoton” and “Rangeley,” both of which are sampling now and are expected to launch in the second half of this year. We’ve actually already heard of the microserver-friendly Avoton from Facebook’s Open Compute Project, whereas Rangeley for network infrastructures was also detailed around the same time; so again, hit up the press release for more details.
Nov 08
Cray unleashes 100 petaflop XC30 supercomputer with up to a million Intel Xeon cores
Posted in: Today's Chili 
Cray has just fired a nuclear salvo in the supercomputer wars with the launch of its XC30, a 100 petaflop-capable brute that can scale up to one million cores. Developed in conjunction with DARPA, the Cascade-codenamed system uses a new type of architecture called Aries interconnect and Intel Xeon E5-2600 processors to easily leapfrog its recent Titan sibling, the previous speed champ. That puts Cray well ahead of rivals like China’s Tianhe-2, and the company will aim to keep that edge by supercharging future versions with Intel Xeon Phi coprocessors and NVIDIA Tesla GPUs. High-end research centers have placed $100 million worth of orders so far (though oddly, DARPA isn’t one of them yet), and units are already shipping in limited numbers — likely by the eighteen-wheeler-full, from the looks of it.
Cray unleashes 100 petaflop XC30 supercomputer with up to a million Intel Xeon cores originally appeared on Engadget on Thu, 08 Nov 2012 10:58:00 EDT. Please see our terms for use of feeds.
Oct 17
Intel may have recently spilled its Q3 guts for 2012, but we highly doubt that the chip maker planned on outing its forthcoming projects for next year. An alleged internal slide makes the claim that the silicon giant plans to introduce a 10-core Xeon E5-2600 V2 Ivy Bridge-EP CPU in the third quarter of 2013. Compatible with Socket R LGA 2011 motherboards, this brute will max out at 20 threads through HyperThreading. Packing 30MB of L3 cache, this unannounced Ivy Bridge supports up to 1866MHz of DDR3 system RAM. If these specifications have whet your appetite, the Xeon E5-2600 V2 is only the tip of the iceberg — Chipzilla is said to also have a 12-core processor in the pipeline as well.
Intel roadmap reveals 10-core Xeon E5-2600 V2 Ivy Bridge CPU originally appeared on Engadget on Wed, 17 Oct 2012 21:04:00 EDT. Please see our terms for use of feeds.
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Aug 31
HotChips is the show where chip makers come to show off their latest slices of silicon, and Knights Corner architect George Chrysos spilled the beans on Santa Clara’s Xeon Phi co-processor. The unit’s designed to bolt onto Xeon chips to help supercomputers crunch the numbers faster, by handling the “highly parallel” grunt work necessary for genetic and climate modeling, among other things. Chrysos has lofty goals for the hardware, hoping that it’ll contribute to “scientific and technical progress,” while we’re just excited to see if it can help the company reclaim its Top 500 crown from IBM.
Filed under: Desktops
Intel opens up about its ‘Knights Corner’ supercomputer co-processor originally appeared on Engadget on Fri, 31 Aug 2012 15:46:00 EDT. Please see our terms for use of feeds.
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